Solder Paste Material for IC PCB BGA Cellphone Repairing Video, Demo, How It Works & Features
This video cannot be played in your browser.
Need price or Contact this supplier?
Get a Quote
Product Specifications
Model NO.:
305
Melting Point:
217ºC
Component:
Sn96.5AG3cu0.5
Tin Powder Particles:
T3/T4
Application:
SMT
Weight:
500g
Cleaning Angle:
No Cleaning
Trademark:
YOSHIDA
Transport Package:
Carton+Foam Box
Specification:
500g
Origin:
China