Transverse Wafer Grinder Thinning Polishing Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
FD-300
After-sales Service:
12months
Warranty:
12months
Type:
Surface Grinding Machine
Processing Object:
Flat Workpieces
Abrasives:
Grinding Wheel
Controlling Mode:
PLC
Automatic Grade:
Semiautomatic
Cylindrical Grinder Type:
Surface Grinding Machine
Precision:
High Precision
Certification:
ISO 9001
Condition:
New
Power Source:
Electricity
Disc(Wheel) Type:
Grinding Disc
Variable Speed:
with Variable Speed
Type:
Thinning Equipment
Application:
Grinding Industry
Working Style:
Thinning
Service:
Oversea Setup & After-Sale Avalaible
Class:
Thinner
Process Station:
1
Abrasive:
Recyclable Water & Grinding Wheel
Wheel Rotate Speed:
0-3000 Rpm
Workpiece Accuracy Control(Parallelism):
1um
Power of Grinding Wheel Motor:
5.5kw
Trademark:
PONDA
Transport Package:
Wood Crate
Origin:
China