Trim Form Singulation System Machine Video, Demo, How It Works & Features
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Product Specifications
Batch Number:
2010+
Certification:
CE
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Power Semiconductor
Model:
LM317
Package:
BGA
Equipment Function:
After Molding, The Product Is Cut and Bent to Form
Applicable Package:
Sop/Ssop/Tsop/to/DLP and Other Series
Punching Power:
Servo Motor Upper Power -3~5t
Punching Speed:
50-100 Strokes/Min (Spm:50-100)
Control System:
PLC (Omron)
Operating System:
Touch Screen + Button, Display Uph/Spm Punching C
Loading Structure:
Rotary Double Magazine Loading
Receiving Mechanism:
Material Tube Collection (Tube Packing)
Safety Protection System:
The Equipment Has Leakage Protection Device, Emerg
Option 1:
CCD Visual Detection Device
Option 2:
Mes System Networking Function
Trademark:
Tjin
Transport Package:
Box
Origin:
China