dB100 Series High Precision Die Bonder Solution Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
DB100
After-sales Service:
Online and Video Service
Condition:
New
Speed:
Medium Speed
Precision:
High Precision
Certification:
ISO, CE
Warranty:
12 Months
Automatic Grade:
Semiautomatic
Type:
Medium-speed Chip Mounter
Max. Chip Size:
Smaller 20mm X20mm(50*50mm Optional)
Min. Chip Size:
0.2*0.2mm
Mounting Precision:
±3um 3δ
Feeding Mode:
2 Inch Waffle Box*2
Substrate Size:
150*150mm
X Y Z Axis Motion System:
Roller Screw + Servo Motor
X Y Axis Resolution:
0.1um
Power Supply:
220V, 50Hz
Net Weight:
150kg
Trademark:
TERMWAY
Transport Package:
Polywood Case
Specification:
800 * 750 * 630mm
Origin:
Beijing, China