Audited Supplier
New Product-4
Rigid Circuit Board
FR-4
Fiberglass Epoxy
V0
Rigid
Electrolytic Foil
OSP,Immersion Gold,Hal Lead Free,Hal
Green,Red,Yellow,White,Black,Blue,etc
Air,Sea,Express(DHL TNT FedEx EMS UPS)
3-5days
ZAPON
Vacuum Packing
UL, TS16949, IPC 600 CLASS 2
China
85340090
Product Description
ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.
The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
We promise:
Reliable quality
Reasonable price
Flexible lead time
The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
We promise:
Reliable quality
Reasonable price
Flexible lead time
| Capabilities | ||
| Number of Layers | From 4-layer to 22- Layer | |
| Material | FR-4,HighTg, Rogers Halogen Free | |
| PCB Thickness | Min.thickness | 0.4mm(16mil) |
| Max.thickness | 3.2mm(128mil) | |
Surface finished | Gold Plating | |
| Immersion Gold(Silver) | ||
| HAL Lead Free | ||
| Hot Air Solder Leveling(HASL) | ||
| Entek Coating (OSP) | ||
| Solder Mask | Green,White,Black,Yellow,Red,Blue | |
| Other printing | Gold Finger | |
| Carbon Print, Peelable Mask | ||
| Solder Mask Plugged Hole | ||
| Copper thickness | 1/ 2 oz (18 μm) - 4 oz (140 μm) | |
| Min. Finished Hole Size | 0.2mm(8mil) | |
| Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
| Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
| Min. Line Width and Spacing | 0.1mm (4 mil) | |
| Min. Solder Mask Clearance | 0.05mm (2 mil) | |
| Min. Annular Ring | 0.076mm (3mil) | |
| Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
| Special Process | Micro-section, Chamfer for Gold Finger | |
| File format | Gerber file , CAM350 ,Protel,PowerPCB | |
| E-TEST | Flying Prob , E-test ,Fixture | |
| Other Test | Impedance , Slice up | |
| Warp & Twist | ≤0.7% | |
