silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package
component substrate, optical component thinning, cutting and so on.
· New, and refurbished, porous ceramic chucks for Disco, K&S, Applied materials TSK, Micro Automation,Load
Point etc dicing saws and grinders
mitigate potential deflection.
We have developed: Dicing Chucks Transparent Chucks Cleaning Chucks Printing Chucks Thinning Chucks

Alumina Porous Ceramic Material Properties | ||
Properties | Units | Value |
alumina(Al2O3) | wt% | ≥ 80 |
silicon dioxide(SiO2) | wt% | 16-18 |
density | g /cm3 | 2.3-2.5 |
hardness (HRA) | HRA ≥ | 50.00 |
flexure strength | MPa ≥ | 40.00 |
compressive strength | ≥ | 600.00 |
porosity | % | 40.00 |
Pore size | μm | 30.00 |
working pressure | MPa ≤ | 10.00 |
acid resistance | mg/cm2 ≤ | 10.00 |
alkali resistance | mg/cm2 ≤ | 20.00 |










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