China Low Cost High Performance Biaxial Inclination Module with Relative/Absolute Zero Setting for Vehicle Overload Monitoring Inclinometer Sensor

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Suzhou Miluo Technology Company

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ML-TI70-A
Servo
Digital Output
Double
0.2G
IP67
ISO
Customized
RS422/RS485/Ttl/Can/Modbus
ML
Box and Sponge
81*40*40mm
China
9031809090
Product Description
ParameterConditionsML-TI70-AUnit
Measuring range ±90±180°
Measuring axisY axis (optional)X, YX 
Accuracy-30~70ºC0.20.3°
Long term stability-30~70ºC<0.22<0.35Hz
Sensitivity temperature coefficient-30~70ºC≤200ppm/ºC
Frequency responseDC response100Hz
Power-on start time 0.2s
Response time 0.01s
Automatic output rate5Hz output, 15Hz, 35Hz, 50Hz can be set (RS485 does not have this function)
Output signalRS232/RS485/RS422/TTL /MODBUS can be ordered
Average working hours≥35000 hours/time
Impact resistance2450g, 0.5ms, 3 times/axis
Anti-vibration10grms,10~1000Hz
Insulation resistance≥100MΩ
Waterproof levelIP67
Cable wireStandard 1.5m length, wear-resistant, oil-proof, wide temperature, shielded cable 4*0.2mm2
Weight 30g (excluding packaging box)









COMPANY INFORMATION
ML is a national high-tech enterprise that has been focusingon using inertial navigationand information fusion technology to solve the accuracy and real-time needs ofvarious types ofmoving objects for navigation information such as position and attitude. Our products coverhigh-tech sensor products from MEMS industrial-grade inertial navigation chips to high-precisioninertial navigation modules, which are mainly used in autopilots ofunmanned systems (includingautopilot/drones/unmanned ships) , satellite tracking,robots, intelligent pursuit, high-speedrail/bridge/dam mapping and other fields.
ML has accumulated strong product R&D and innovation capabilities through years ofaccumulation in chip design, process manufacturing, industry algorithms and calibration capabilitiesin the MEMS inertial industry. At present, the company has obtained several invention patents andsoftware copyrights, covering MEMS inertial navigation chips and modules, and has successfully usedthese patents to realize product transformation.
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