Diamond Multi-Wire Saw Machine for Sapphire Quartz Crystal Cutting Tool

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Yantai Likai Numerical Control Technology Co., Ltd.

VIP   Audited Supplier 2 years
Profile Certified by SGS/BV
CA600
on-Site Installation, Commissioning and Training
12 Months After Acceptance
New
CE, ISO 9001: 2015
Automatic
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
600X600X600mm
1500m/Min
Provide Test Cut Service
9500kg
2850X2350X3200mm
LiKai
Wooden Case
China
8464109000
Product Description
Product Description
CA600 Multi-wire Saw is mainly used for slice processing of super hard and brittle materials such as Sapphire, Quartz Crystal, Special Ceramics, Silicon Nitride, etc. The machine is suitable for cutting materials in medium and large size with the advantages of high cutting efficiency, high accuracy, stable quality and low costs. The four rollers design can cut products larger than 1mm.
 
Product Features

>The whole casting structure has high damping coefficient and excellent vibration damping performance.

The worktable swings with the workpiece center as axis for stable cutting.

Both front and rear bearing boxes of rollers adopt oil-cooled bushing structure to ensure high running speed.

The wire pay-off wheel adopts the standard universal spool (PV600 reinforced I-wheel), and it's no need to rewind.

Wire break memory system.

 
Cut Samples
 

 

Product Parameters
 
ItemDetailParameter
ModelModelCA600
AbilityMaximum work size600x600x600mm
Wire Guide RollerOut diameter *Workable widthΦ170±10*610mm*4 rollers
Diamond wireWire diameterφ0.12mm-φ0.25mm
Storage (PV600 reinforced I-wheel)40km(φ0.25mm)
Maximum running speed1500m/min
WorkbenchQuantity1
Travel of table750mm
Table swing±10°
Cutting methodVertically upward movement
Cutting feed speed0.1~99.9mm/min
Cutting fluidFluidWater-based cutting fluid or cutting oil
Storage500L
Flow rate200L/min
PowerPower supply380V±10%  50Hz
Power55kw
Air supplyAdopting water-based cutting fluid, the air pressure is ≥ 0.4 MPa.
Size & WeightSize L*W*H2850mm*2350mm*3200mm
Weight9500Kg

 

About Us

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.

2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.

3. What's The Cut Accuracy Of Multi-Wire Saws?
   
±10μm. It's subject to the cut material, please consult us for actual data.

4. Can I get a sample?
    We provide test cut service to you, free of charge. Please send your material and test requirements to us.

5. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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