Manual Ultrasonic Thin Wire Wedge Bonding Machine

Application:

 COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.

Specification:

  1,electric requirement:220VAC±10%,50HZ,be sure connected to ground

  2,wire diameter:25~75μm wedge bonding.

  3,ultrasonic power:0-3W, two channel. can be set separately of the two point

  4,bond time:5-200ms,two channel

  5,bond force:10-60g,two channel

  6, span between first bond to second bond by automatic mode:0-10mm(motorized)

  7,bond radian: 0-6mm(motorized)

  8, jig moving area: Φ16mm

  9,mouse hand:20*20mm

  10,digital camera: optional

  11,dimension:600*560*390mm

  12,weight:36kg

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guangzhou minder-hightech co.,ltd
contact:shunyu.hu