OEM Green PCB Printed Circuit Boards Moving Head Strobe Light PCB Lead Free HASL Large Size

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Ucreate PCB Co., Ltd.

VIP   Audited Supplier 10 years
Profile Certified by SGS/BV
UC-57458
Rigid Circuit Board
FR-4
Fiberglass Epoxy
Consumer Electronics
V0
Rigid
Electrolytic Foil
Copper
Organic Resin
UC
4
1.6mm
Fr4
Green
Immersion Gold/HASL Lead Free/ Immersion Silve
E-Testing, Flying Probe Testing
Green/White/Black/Blue/Red/Purple
3 Working Days
6 Working Days
Ipc Class II
UC
Vacuum Package
UL(US&Canada). ISO9001. RoHs, TS, SGS
Shenzhen, China
8534009000
Product Description
Ucreate LTD PCB's aim:
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
 
 
1.Technical Capabilities:
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control
±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness
 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 
0.75% 


2. Product Applications:
 

3. Market distributions:



4.Products Equipment :

5.Product Description:
*Layers: 1-22
*Base material: FR-4 CEM-1
*Thickness: 0.2-5.0mm
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)


We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.

Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours



6.Producing processes:


We specilized in :   
Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.

Production processes:
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

PCB assembly Equipment:
1. High speed and precision chip placer or multi-function SMD mounter
2. Wave soldering machine
3. Vacuum machine
4. High temperature box
5. Auto-solder paste printer
6. Hot- and mixed-air reflow



Requested informations for PCBA:
1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary

2. PCB board information
(a) Gerber files
(b) PCB board processing technic

3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Package requirement


Why Choose Us?
1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM,  we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information



Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shen zhen,Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PCS



Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement



Certificates:


 
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