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S-SnCu0.7 Tin Copper wire's melting point is close to leaded metal spraying materials and its performance on the capacitor is also close to the leaded metal spraying materials. It is an ideal metal spaying material for laminated capacitors.
The surface is smooth and clean without bubbles, burrs,s or other defects.
The mechanical property and surface quality are highly uniform.
The metal spraying of metalized film capacitors is of strong adhesion with good weldability and low loss angle.
The product conforms to the requirements of EU RoHS, REACH, and relevant domestic laws and regulations for environmental protection.
Product code: solder wire
Chemical composition:
| ITEM | Melting Range (ºC) | Elements (%) | |||||||||||
| Sn | Ag | Cu | Sb | Pb | Cd | Fe | As | Al | Zn | Bi | TTL | ||
| S-SnCu0.7 | 227 | REMAINING | 0.1 | 0.5-0.9 | 0.1 | 0.05 | 0.0012 | 0.02 | 0.03 | 0.001 | 0.001 | 0.015 | 0.2 |
| S-SnCu0.3 | 227~235 | REMAINING | 0.1 | 0.2-0.4 | |||||||||
| S-SnCu3 | 227~310 | REMAINING | 0.1 | 2.5-3.5 | |||||||||
| S-SnAg3 | 221~224 | REMAINING | 2.8-3.2 | 0.05 | |||||||||
| S-SnAg3.5 | 221 | REMAINING | 3.3-3.7 | 0.05 | |||||||||
| S-SnAg5 | 221~240 | REMAINING | 4.8-5.2 | 0.05 | |||||||||
| S-SnAg1Cu0.5 | 217~227 | REMAINING | 0.8-1.2 | 0.3-0.7 | |||||||||
| S-SnAg1Cu0.7 | 217~224 | REMAINING | 0.8-1.2 | 0.5-0.9 | |||||||||
| S-SnAg3Cu0.5 | 217~220 | REMAINING | 2.8-3.2 | 0.3-0.7 | |||||||||
| S-SnAg4Cu0.5 | 217~219 | REMAINING | 3.8-4.2 | 0.3-0.7 | |||||||||
| S-SnAg3.5Cu0.7 | 217~218 | REMAINING | 3.3-3.7 | 0.5-0.9 | |||||||||
| S-SnAg3.8Cu0.7 | 217 | REMAINING | 3.6-4.0 | 0.5-0.9 | |||||||||
| S-SnCu0.7Ag0.3 | 217~227 | REMAINING | 0.2-0.4 | 0.5-0.9 | |||||||||
| S-SnCu4Ag1 | 217~353 | REMAINING | 0.8-1.2 | 3.5-4.5 | |||||||||
| S-SnCu6Ag2 | 217~380 | REMAINING | 1.8-2.2 | 5.5-6.5 | |||||||||
| S-SnSb5 | 235~240 | REMAINING | 0.1 | 0.05 | 4.5-5.5 | ||||||||
| S-SnZn9 | 199 | REMAINING | 0.1 | 0.05 | 0.1 | 8.5-9.5 | |||||||
| DIAMETER (MM) | PERMISSIBLE VARIATION |
| 0.5-0.8 | ±0.03 |
| 0.8-1.2 | ±0.07 |
| 1.2-2.5 | ±0.1 |
Applicable to the heat-labile components cryogenic package field manual soldering iron welding, automatic welding; suitable for thermal fuse, thermal protection, thermal fuse.
main used for the soldering of precision instruments, electrical and electronics, wave soldering and circuit board elements and aviation.
Solder is an indispensable material for the manufacture of electronic products. Tin wire, tin bar, and tin paste are the most widely used electronic welding materials, the technical level depends on the performance of solder joints and welding process performance.
Tin base Babbitts are considered superior to Lead base alloys for most applications because they are easier to pour and provide a good bond between the bearing shell and lining. In this process, Babbitt ingots are melted and then poured into bearing cavities, allowed to harden, and then the surface is machined down to meet the required tolerances.
Product packing:
| Hard paper drum | 100-150 kg | outer diameter 550 mm, inner diameter300mm, variable height |
| Hard paper drum | 20-50 kg | outer diameter 400 mm, inner diameter190mm. variable height |
| Plastic spool | 15 kg | flange300mm, width100mm, center hole:55mm |
| Plastic spool | 0.5-10 kg | |
| bundle | 10-20 kg |
Widely used in various wave soldering and manual welding of television, audio, capacitors, circuit boards, and communications equipment. and look forward to your cooperation!
