Semiconductor Transfer Mold

Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has led to the continuous improvement of packaging mold application technology. The traditional single-injection head packaging mold can no longer meet the packaging requirements. The mold structure has developed from single-cylinder mold → multi-injection head packaging mold (MGP) → integrated circuit automatic packaging system.

Main packaging forms

TO series: T0220/263/247/252/3P, etc.;

SOP series: SOP4/6/8/1 0/12/14/16/20/28, etc.;

DIP series: DIP4/8/14/16/18/23/24/25/29/40, etc.;

SOT series: SOT23/25/26/223/89, etc.;

SOD series: S0D123/323/523/723/923, etc.;

QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.;

QFP/IPM series, etc.;