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Plasma cleaning can remove nanoscale contamination and alter surface chemistry properties without affecting the performance of bulk materials. Plasma cleaning is performed at near ambient temperatures to minimize the risk of damage to the heat sensitive material. According to the use of process gases and process conditions, plasma cleaning can be used for cleaning, activation, etching and surface modification. It can be applied to a wide range of materials as well as complex surface geometries and a variety of applications, including materials science, polymers science, biomedical materials, microfluidics, optics, microscopy, dentistry, medical research, precision components including semiconductors, crystals, resistors, capacitors, PCB, IC chips, connectors, silicon wafers, transistors, electronic circuit boards, computer motherboards, piezoelectric ceramic substrates, image tube and other electronic devices cleaning during production and processing process. It mainly deals with materials with small area, high precision of processing track and many edges and corners. Plasma cleaning as a product surface printing, packaging, fitting, coating, welding, viscose, coating process, is an important part of product upgrading, capacity expansion, cost reduction.
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| Item No. | AP-BK-D04 | AP-BK-D30 | AP-BK-D50 | AP-BK-D80 |
| Processing Width | 4mm | 30mm | 50mm | 80mm |
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| Item No. | AP-BE-D04 | AP-BE-D30 | AP-BE-D50 | AP-BE-D80 |
| Processing Width | 4mm | 30mm | 50mm | 80mm |
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| Item No. | AP-WH-D04 | AP-WH-D30 | AP-WH-D50 | AP-WH-D80 |
| Processing Width | 4mm | 30mm | 50mm | 80mm |
| Remark | 1) For Installmet Position: (For easy to operate) *AP-WH-D## and AP-BE-D## : they are suitable for placeing on the high positon because the control panel in the front of host, such as placeing on the table. *AP-BK-D##: it is suitable for placeing under the low positon because the control panel on the top of host, such as placeing under conveyor. 2) For Ambient Temperature: (For stable working) *AP-WH-D##: it is suitable for working in the low temperater workshops because the housing of host is too small, such as ambient temperature less than 20 degree. *AP-BE-D## and AP-BK-D##: they are suitable for working in the general temperater workshops because the biger host with high cooling effect, such as ambient temperature less than 25 degree, but the cooling effect of AP-BK-D## is better than AP-BE-D##. 3) For Function: * They are same, the detailed specification as below. * You just choose the machines with the suitable processing width to meed your need. | |||
| Input Voltage | AC220V/50Hz ( or customization) | |||
| Power Output | 500W | 550W | 700W | 1000W |
| Frequency | 20K-50KHz | |||
| Air Pressure | 4kg/0.4MPa | |||
| Gas Used | Air / N2 | |||
| Cable Length | 3m ( or customization) | |||
| Control mode | Local control, remote control | |||
| Host size(L*D*H) | 140*370*420mm | |||
| Host Weight | 11.3kgs | |||
| Placement | Placed vertically or horizontally | |||
| Gun size | D30*H200mm | W80*D140*H300mm | ||
| Gun weight | 0.8kgs | 4.0kgs | 4.2kgs | 4.5kgs |
| Protection function | Overtemperature protection, overload protection, short circuit, circuit break, overload, leakage protection | |||
| Certifiaction | CE, ROHS, FCC | |||
| Warranty | 1 year | |||
| Packing info. | 1set/ctn Ctn size:56*43*30cm GW:14kgs | 1set/ctn Ctn size:56*43*30cm GW:16.5kgs | 1set/ctn Ctn size:56*43*30cm GW:17kgs | 1set/ctn Ctn size:56*43*30cm GW:17.5kgs |
Different plasma workstations with 3/5 axis for you to chiose from.
Different vacuum plasma machines for you to chiose from.
Different conveyors with plasma cleaner for you to chiose from.
