Audited Supplier
Solder Paste 60 40
Liquid
Neutral
Solder Paste
<200℃
Make the Liquid Solder Flow
SMT
Smelting
Tin Lead
Type 3: 25 to 45 Microns
Type 4: 20 to 38 Microns
No Clean Flux
Sn63pb37
Sn60pb40
Sn55pb45
Sn50pb50
Jar
Syringe
Courier / Air Freight
6months
0 to 10 Degree Celsius
for SMD Components Soldering
for BGA Reballing Soldering
XF Solder
Foam Box
100g to 1000g
China
3810100000
Product Description
Solder Past BGA SMD Soldering Paste Flux Grease 60 40 Sn60Pb40
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc
Applications of Tin Lead Solder Paste Sn63Pb37 63 37:
Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.
Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.
It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.
General soldering and repairing works for small projects or for hobbyist.
How to use Tin Lead Solder Paste Sn63Pb37 63 37?
Stencil Printing: Prepare and clean stencil and PCB properly. Using a squeegee, a stencil printer, or a similar tool, apply the solder paste 63 37 over the stencil, allowing the paste to be pushed through the openings and onto the PCB pads. Apply even pressure to ensure consistent solder paste deposition.
Place IC Components: Precisely place surface mount components onto the solder paste-covered pads. Ensure that the component leads or pads align correctly with the solder paste deposits.
Reflow Soldering: Place the PCB with the components onto a conveyor belt in a reflow oven or onto a hot plate for reflow soldering. The reflow process involves heating the PCB to melt the solder paste 63 37 and create solder joints. Follow the reflowing manual for reflow temperature profiles and times.
Instruction on Storage and Using of Tin Lead Solder Paste Sn63Pb37 63 37:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
We produce differenty types of solder paste:
Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc
Applications of Tin Lead Solder Paste Sn63Pb37 63 37:Sn63Pb37 solder paste can be used in the assembly of consumer electronic products such as smartphones, tablets, laptops, TVs, and audio equipment, LED lighting products etc.
Tin lead solder paste 63 37 can be used in many automotive electronic control units (ECUs), sensors, and modules are assembled using Sn63Pb37 solder paste.
It can be used in industrial electronics such as Industrial automation systems, control panel, solar panels etc.
General soldering and repairing works for small projects or for hobbyist.
How to use Tin Lead Solder Paste Sn63Pb37 63 37?
Stencil Printing: Prepare and clean stencil and PCB properly. Using a squeegee, a stencil printer, or a similar tool, apply the solder paste 63 37 over the stencil, allowing the paste to be pushed through the openings and onto the PCB pads. Apply even pressure to ensure consistent solder paste deposition.
Place IC Components: Precisely place surface mount components onto the solder paste-covered pads. Ensure that the component leads or pads align correctly with the solder paste deposits.
Reflow Soldering: Place the PCB with the components onto a conveyor belt in a reflow oven or onto a hot plate for reflow soldering. The reflow process involves heating the PCB to melt the solder paste 63 37 and create solder joints. Follow the reflowing manual for reflow temperature profiles and times.
Instruction on Storage and Using of Tin Lead Solder Paste Sn63Pb37 63 37:
It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
