Vacuum Spraying Vacuum Unit Magnetron Sputtering Machine

Material involved: plastic, metal, glass, ceramic, carbon fiber

DC magnetron sputtering coating equipment is usually used for:

Automotive lights, automotive wheels, solar collectors, conductive films, shielding films, ITO glass, glass silver mirrors, plastic products such as chrome, titanium and other metal and metal compound coatings, can also be used to deposit PVD hard film On gears, twist drills, taps, molds

Unbalanced magnetron sputtering coating equipment is usually used for plating various colors, carbon golf clubs on metal, metal and ceramic products

Magnetron sputtering is a kind of PVD technology which can apply different kind of metal coatings on susbtrates with a sputtering cathode. This machine is capable to work with different raw materials such as plastic, metal, ceramic, glass.

Both of batch type and continuous inline sputtering system are available for different applications.

The coatings made by sputtering is good quality than it made by thermal evaporation. Argon gas is required to introduce into the vacuum chamber for the process.

We provide different types of sputtering cathodes: DC sputtering, unbalanced sputtering cathode. We provide the complete machine, also the cathodes which are designed according to your requirements.

Maximum loading size:                   We design the vacuum chamber size and loading fixture                                                                    according to customer requirements

Vacuum chamber type:                   Vertical

Vacuum chamber material:             Stainless steel or carbon steel

Applicable substrate material:        PC, PET, PP, PE, etc.

PVD technology:                              DC magnetron sputtering or unbalanced sputtering

Extraction speed:                            8min can reach 0.05Pa

Vacuum system:                             Turbo molecular pump or diffusion pump + roots pump +                                                                    mechanical pump

Processing cycle:                            It takes less than 15 minutes to complete the process from                                                                substrate placement, sputtering, and removal. It also varies                                                              according to different processes.

Reflectivity:                                     85% or more

Sputtering chamber:                      High utilization sputtering cathode

Sputtering power type:                  DC or unbalanced sputtering power

Sputtering materials:                     Aluminum, copper, titanium, stainless steel, silver, etc.                                                                       according to customer process requirements

Process gas:                                   Argon, nitrogen, oxygen, acetylene, etc