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Audited Supplier
2 Years
Jiangsu Himalaya Semiconductor Co., Ltd.
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
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High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System
$
1000000.00
MOQ:1 Piece
Double Drive Longmen Interactive Fiber Laser Cutting Equipment for Sheet Metal Case Cabinets/Lighting Advertising
$
1000000.00
MOQ:1 Piece
Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
$
1000000.00
MOQ:1 Piece
Large-Screen LCD Instrument High Temperature Vacuum Oven for Electronics/Aerospace/Military Weapons/Pharmaceuticals
$
1000000.00
MOQ:1 Piece
Copper Slurry Thick Film Circuit Sintering Furnace with Rapid Control Response
$
1000000.00
MOQ:1 Piece
Manufacture High Efficiency Laser Glue Removal and Repair Machine with Visual Positioning
$
1000000.00
MOQ:1 Piece
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Audited Supplier2 Years