Double Drive Longmen Interactive Fiber Laser Cutting Equipment for Sheet Metal Case Cabinets/Lighting Advertising

Price $1000000.00 Compare
Min Order 1 Piece
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Jiangsu Himalaya Semiconductor Co., Ltd.

VIP   Audited Supplier 3 years
Profile Certified by SGS/BV
  • Jiangsu, China
  • Jack (Mr.)  
    Deputy General Manager
Provided
Provided
Semiconductor Laser
Laser Cutting Machine
Guaranteed Quality
Customized According to Needs
Provided
Himalaya
Customized or Wooden Box Packaging
Standard Specifications
China
Product Description
 
Product Description

MPS-3015D series laser cutting machine adopts gear rack transmission structure, effectively ensure the running speed and accuracy, can be used for general sheet metal cutting.

The machine tool adopts several CAE analysis, demonstration and verification of the overall profile welding structure. Annealing eliminates internal stress and finishes machining, which solves the stresses caused by welding and processing, thus improving the rigidity and stability of the equipment

Gantry adopts the whole casting structure of high strength aluminum alloy, which has the advantages of light weight and good dynamic response

The precision helical gear transmission mechanism is adopted in the X/Y axis, which ensures the accuracy and speed in the cutting process

has better stability and longer service life

Excellent processing system, friendly interface, easy operation, and can be real-time feedback on the processing state, to ensure the orderly processing


 
Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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