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0.635mm Solder PCB DCP Sheet Aln Aluminum Nitride Ceramic Substrate with Copper

Name: 0.635mm Solder PCB DCP Sheet Aln Aluminum Nitride Ceramic Substrate with Copper
Uploaded: 2025-05-18T16:07:14+08:00

2025-04-09 4110

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Product Specifications

Model NO.:

BBXAN001

Application:

Electronics

Material:

Metalized Ceramic

Type:

Ceramic Plate

Process:

Direct Bonded Copper

Thickness:

0.38 mm

Application:

Structure Ceramic, Industrial Ceramic

Material:

Aluminum Nitride

Product Name:

Track Design Aln Aluminum Nitride Ceramic Substra

Feature:

Good Thermal Conductivity

Density(g/cm3):

3.3G/Cm3

Dielectric Strength:

≥15kv/mm

Surface Roughness:

0.3-0.5ra(μm)

Size:

Can Be Customised

Temperature:

High Temperature Resistant

Thermal Conductivity(20°c, W/M.K):

≥170

Corrosive Characteristics:

Corrosion Preventive

Flexural Strength (MPa):

≥330

Key Words 1:

Aln Aluminum Nitride Ceramic Substrate

Key Words 2:

Ain Ceramic Substrate with Copper

Type:

Ceramic Plates

Trademark:

BB

Transport Package:

Export Carton or Wood Boxes

Specification:

Be Customed

Origin:

China (Mainland)

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