Product Specifications
BBXAN001
Electronics
Metalized Ceramic
Ceramic Plate
Direct Bonded Copper
0.38 mm
Structure Ceramic, Industrial Ceramic
Aluminum Nitride
Track Design Aln Aluminum Nitride Ceramic Substra
Good Thermal Conductivity
3.3G/Cm3
≥15kv/mm
0.3-0.5ra(μm)
Can Be Customised
High Temperature Resistant
≥170
Corrosion Preventive
≥330
Aln Aluminum Nitride Ceramic Substrate
Ain Ceramic Substrate with Copper
Ceramic Plates
BB
Export Carton or Wood Boxes
Be Customed
China (Mainland)