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Besi Datacon 8800 FC Quantum Advanced Die Bonding Machine Video,Demo, How It Works & Features

Name: Besi Datacon 8800 FC Quantum Advanced Die Bonding Machine
Uploaded: 2026-02-11T13:04:15+08:00

2025-04-09 3530

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Product Specifications

Model NO.:

Datacon 8800 FC QUANTUM advanced

After-sales Service:

24 Hrs Online

Condition:

Used

Speed:

High Speed

Precision:

High Precision

Certification:

RoHS, ISO, CE

Warranty:

6 Months

Automatic Grade:

Automatic

Type:

Die Bonding Machine

Characteristics:

Used

Product Number:

Datacon 8800 FC Quantum Advanced

Quality:

Tested

Types:

Besi Die Bond Machine

Usage:

Die Bond Machine

Industry:

Chip Industry

Supply Ability:

2000 PCS

Price:

Good

Trademark:

BESI

Transport Package:

Carton Packing or Wooden Case

Specification:

One piece per package

Origin:

USA

HS Code:

8479909090

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