CZ Silicon Wafer Prime Quality Polished Semiconductor Silicon Oxide Wafer Video,Demo, How It Works & Features

2026-07-01 3100

Product Specifications

6inch 300A
Semi Standard
Compound Semiconductor
P-Type Semiconductor
CZ
100
Boron
1-100Ω
Polished
Etched
150±0.3mm
675±25mm
300A
≤10μm
≤30μm
≤30μm
FSM
Semi Standard
TBD
China
3818001920
Dislike 0 Comment 0
More>Recommended Video
Resin Bond Diamond Wheels, Phenolic and Polyimide. Double Side Grinding Discs

283

Superabrasives, Diamond, CBN, and CDX Grinding Wheels

509

Superabrasive Diamond and CBN Grinding Wheel, Periphery Grinding Wheel

495

Superabrasive Diamond and CBN Grinding Wheels, Diamond Wheels for Periphery Grinding of Carbide, Ceramic, and Cermet Inserts.

387

Diamond and CBN Wheels, Flute Grinding, Clearance and Face Surface Grinding, Profile Grinding

479

Diamond and CBN Grinding Wheel for Face Grinding of Circular Saws Shape 4A2, 4b9, 4c9

365

Resin Bond Superabrasive Grinding Wheels, Diamond and CBN Grinding Wheels

450

Crankshaft Grinding Wheels, Abrasives Grinding Wheels, Conventional

362

Diamond & CBN Grinding Wheels - Flaring Cup D11A2, Tct Circular Saw Grinding Machine

235

Centerless Grinding Wheels, Superabrasive Diamond & CBN Grinding Tools

477

Diamond and CBN Grinding Wheels for Iseli Machines Shape 3V1, 6A9

246

Abrasive Fibre Discs, Cutting Wheels, Grinding Wheels, Conventional

490