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Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine

2025-04-09 3880IP Unknown

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Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
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Product Specifications

After-sales Service:

Provided

Condition:

New

Speed:

High Speed

Precision:

High Precision

Certification:

ISO

Warranty:

12 Months

Automatic Grade:

Automatic

Product Name:

Semiconductor Equipment

Feature 1:

Guaranteed Quality

Feature 2:

Customized According to Needs

After-Sale Service:

Provided

Trademark:

Himalaya

Transport Package:

Customized or Wooden Box Packaging

Specification:

Standard Specifications

Origin:

China

You May Like: Die Bonder, Factory Price, Factory Wholesale, High Quality

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