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Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine Video,Demo, How It Works & Features

2025-04-09 4090

High End Laser Dicing Processing Ceramic Equipment
332 views

Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
333 views

Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
409 views

High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
297 views

Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production
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Product Specifications

After-sales Service:

Provided

Condition:

New

Speed:

High Speed

Precision:

High Precision

Certification:

ISO

Warranty:

12 Months

Automatic Grade:

Automatic

Product Name:

Semiconductor Equipment

Feature 1:

Guaranteed Quality

Feature 2:

Customized According to Needs

After-Sale Service:

Provided

Trademark:

Himalaya

Transport Package:

Customized or Wooden Box Packaging

Specification:

Standard Specifications

Origin:

China

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