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Electronic Direct Bond Copper Aln Plate Insulator Aluminum Nitride Ceramic Substrate Video,Demo, How It Works & Features

Name: Electronic Direct Bond Copper Aln Plate Insulator Aluminum Nitride Ceramic Substrate
Uploaded: 2025-07-09T11:07:00+08:00

2025-04-09 3480

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Product Specifications

Model NO.:

BBTAN001

Application:

Electronics

Type:

Ceramic Plate

Application:

Electronics, Refractory, Industrial Ceramic

Type:

Ceramic Plate

Function:

Wear Resistant

Process:

Porcelain Ceramic Plate

Material:

Aluminum Nitride

Color:

Ivory

Density:

3.3 g/cm3

Size:

Customized

Thermal Conductivity(30°c, W/M.K):

>170

Flexural Strength (MPa):

382.7

Keyword:

Copper Coated

Dielectric Strength (Kv/mm):

18.45

MOQ:

2 PCS

Keywords 1:

Aluminum Nitride Substrate

Keywords 2:

Copper Plating Substrate

Trademark:

Transport Package:

Packaged by Polybay and Bubble Bag in The Stardard

Specification:

OEM

Origin:

China

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