Electronic Direct Bond Copper Aln Plate Insulator Aluminum Nitride Ceramic Substrate

2025-04-09 3410

Product Specifications

BBTAN001
Electronics
Ceramic Plate
Electronics, Refractory, Industrial Ceramic
Ceramic Plate
Wear Resistant
Porcelain Ceramic Plate
Aluminum Nitride
Ivory
3.3 g/cm3
Customized
>170
382.7
Copper Coated
18.45
2 PCS
Aluminum Nitride Substrate
Copper Plating Substrate
BB
Packaged by Polybay and Bubble Bag in The Stardard
OEM
China
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