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Electronic Direct Bond Copper Amb Metallized Aln Plate Aluminum Nitride Ceramic Substrate Video,Demo, How It Works & Features

Name: Electronic Direct Bond Copper Amb Metallized Aln Plate Aluminum Nitride Ceramic Substrate
Uploaded: 2026-05-14T14:26:32+08:00

2025-04-09 4100

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Product Specifications

Model NO.:

HBQ-E006

Application:

Electronics, Electronic Devices, Power Supply, Semiconductors

Type:

Ceramic Plate

Material:

Aln

Process:

Direct Bonded Copper

Material of Substrate:

Alumina/Aln

Conducting Layer:

0.5um-1mm

Technology:

Htcc/Dpc/Dbc

Film:

Single/Double

Surface:

Bare Cu/Ni-Plating/Au Plating

Feature:

Electrical Insulation/ High Thermal Conductivity

Usage:

Thick Film Circuit, Large-Scale Integrated Circuit

Keywords:

Customized Amb Metallized Aln Aluminum Nitride Cer

Trademark:

BAIBO

Transport Package:

Export Packing

Specification:

Customized

Origin:

China(Mainland); Jiangsu

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