Electronic Direct Bond Copper Amb Metallized Aln Plate Aluminum Nitride Ceramic Substrate Video,Demo, How It Works & Features

2025-04-09 3930

Product Specifications

HBQ-E006
Electronics, Electronic Devices, Power Supply, Semiconductors
Ceramic Plate
Aln
Direct Bonded Copper
Alumina/Aln
0.5um-1mm
Htcc/Dpc/Dbc
Single/Double
Bare Cu/Ni-Plating/Au Plating
Electrical Insulation/ High Thermal Conductivity
Thick Film Circuit, Large-Scale Integrated Circuit
Customized Amb Metallized Aln Aluminum Nitride Cer
BAIBO
Export Packing
Customized
China(Mainland); Jiangsu
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