Excellent Thermal Conductivity Aluminium Nitride Aln Ceramic Substrate Video,Demo, How It Works & Features_MadeInChina.com

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Excellent Thermal Conductivity Aluminium Nitride Aln Ceramic Substrate Video,Demo, How It Works & Features 2025-04-09 4970
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Product Specifications

Model NO.:

WTK-Substrate

Application:

Electronic Devices, Lighting, Power Supply, Semiconductors

Conductive Layer:

Thick Copper Layer

Material:

AlN

Process:

Direct Bonded Copper

Thickness:

0.25, 0.32, 0.38, 0.5, 0.635, 0.76, 1, 2mm

Density:

3.33G/Cm3

Color:

Grey

Flexural Strength:

450 MPa

Thermal Conductivity:

>180 W/M.K

Dielectric Strength:

>20 Kv/mm

Type:

Ceramic Plate

Trademark:

WINTRUSTEK

Transport Package:

Carton, Wooden Box, Pallet

Specification:

Customized

Origin:

Fujian, China

HS Code:

8547100000

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