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Hard Gold PCB Multilayer Printed Circuit Board with Blind and Buried Vias Video,Demo, How It Works & Features

Name: Hard Gold PCB Multilayer Printed Circuit Board with Blind and Buried Vias
Uploaded: 2026-02-25T00:37:52+08:00

2025-04-09 3080

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Product Specifications

Model NO.:

PCB-A1

Type:

Rigid Circuit Board

Dielectric:

FR-4

Material:

Fiberglass Epoxy

Application:

Consumer Electronics

Flame Retardant Properties:

Mechanical Rigid:

Rigid

Processing Technology:

Electrolytic Foil

Base Material:

Kingboard

Insulation Materials:

Epoxy Resin

Brand:

Abis

Holes Specification:

Buried/Blind Vias, Via in Pads, Counter Sink Hole

Enig Thickness:

1-3u''

Board Thickness:

0.2-6mm

Hard Gold Thickness:

1-50u''

Layers:

1-20layers

Copper Thickness:

0.5-8oz

Certification:

UL, ISO9001&ISO14001, SGS, RoHS, IATF16949

Trademark:

Abis Circuits

Transport Package:

Vacuum Packing

Specification:

Custom

Origin:

Shenzhen, China

HS Code:

85340010

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