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High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use

2025-04-09 4900

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Product Specifications

Model NO.:

MDSJHYZP0225

After-sales Service:

1 Year

Condition:

New

Speed:

High Speed

Precision:

Precision

Certification:

CE

Warranty:

12 Months

Automatic Grade:

Manual

Type:

High-speed Chip Mounter

Trademark:

minderhightech

Origin:

China

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