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High Temperature Solder Paste Sn5pb92.5AG2.5 Special for Semiconductor Packaging and Welding

Name: High Temperature Solder Paste Sn5pb92.5AG2.5 Special for Semiconductor Packaging and Welding
Uploaded: 2025-05-23T02:56:31+08:00

2025-04-09 2330

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Product Specifications

Model NO.:

SD-600

Component:

Sn5pb92.5AG2.5

Melting Point:

268-302ºC

Attribute:

RoHS Exempt

Tin Powder:

T3/T4

Application:

Semiconductor Welding

Trademark:

yoshida

Transport Package:

Carton Packaging

Specification:

500G

Origin:

China

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