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Multi-Layer PCBA Board Assembly SMT and DIP Technology One-Stop PCBA Manufacturing Solution PCB

Name: Multi-Layer PCBA Board Assembly SMT and DIP Technology One-Stop PCBA Manufacturing Solution PCB
Uploaded: 2025-03-25T19:14:59+08:00

2025-04-09 4070IP Unknown

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Product Specifications

Type:

Rigid Circuit Board

Dielectric:

FR-4

Material:

Fiberglass Epoxy

Application:

Consumer Electronics

Flame Retardant Properties:

V0

Mechanical Rigid:

Rigid

Processing Technology:

Electrolytic Foil

Base Material:

Copper

Insulation Materials:

Organic Resin

Brand:

Haizhanni

MOQ:

0

Test:

100% E-Test

Copper Thickness:

0.5-120z(18-420um)

Board Thickness:

1.0-2.0mm

HS:

8534009

Annual Production Capacity:

500000PCS/Year

Solder Mask Color:

Green/Black/White/Red/Blue/Y Ellow

Layers:

1-24layers

Certification:

IATF16949, UL, ISO

Surface Treatment:

Gold Finger/Hard Gold/HASL/Haslfree

Trademark:

haizhanni

Transport Package:

Customized, ESD Bag/Vacuumpackaging+Bubble Bag.

Specification:

102mm*100mm

Origin:

China

HS Code:

8534009

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