Name: Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
Uploaded: 2026-07-12T11:30:51+08:00
Description: Watch the Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers video demo to see how it works, key features, and real-use scenarios. A helpful video guide before you buy.

Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers Video,Demo, How It Works & Features 2026-05-13 4980
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Product Specifications

Model NO.:

DA600

After-sales Service:

on-Site Installation, Commissioning and Training

Warranty:

12 Months After Acceptance

Condition:

New

Certification:

CE, ISO 9001: 2015

Automation:

Automatic

Suitable for:

Aluminum, Alloy, Sapphire, Quartz Crystal, Silicon, Magnets

Maximum Worksize:

205X205X600mm

Maximum Running Speed:

2400m/Min

Test Cut:

Provide Test Cut Service

Dimension:

4300X1650X3300mm

Weight:

13000kg

Trademark:

LiKai

Transport Package:

Wooden Case

Origin:

China

HS Code:

8464109000

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Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers Video,Demo, How It Works & Features

Product Specifications