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Precision Grinding Machine for Semiconductor

Name: Precision Grinding Machine for Semiconductor
Uploaded: 2025-05-17T02:51:39+08:00

2025-04-09 2880

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Product Specifications

Diameter:

8 Inch

Speed of Working Disc:

0-600rpm, Stepless Speed Regulation

Direction of Working Disc:

Cw/Ccw

Power of Working Disc:

750W

Factory Inspection of Working Disc:

Flatness < 2um

Speed of Sample Holder:

0-50rpm, Stepless Speed Regulation

Direction of Sample Holder:

Cw/Ccw

Rotate:

Y, Adjustable

Swing:

Y, Swing Range and Speed Adjustable

Factory Inspection of Sample Holder:

Perpendicularity to The Disk <2um; Parallelism <2u

Maximum Removal Capacity:

20mm

Power Supply:

220VAC

Panel:

7-Inch Touch Screen

Wxdxh:

700X430X580mm

Weight:

57kg

Trademark:

Trojan

Transport Package:

Standard Case or Customized

Specification:

700x430x580mm

Origin:

China

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