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Repair BGA Planting Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.5mm Tin Particles

2025-04-09 4790IP Unknown

  • Repair BGA Planting Lead-Free Solder Ball Sn96.5AG3cu0.5 Diameter 0.5mm Tin Particles

  • 479 views

Product Specifications

305
Sn96.5AG3cu0.5
250K
Melting Point
217°c
PROFOUND
Carton+Foam Box
1pc
Taiwan
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