Sn62pb36AG2 MID Temperature Leaded Soldering Tin Lead Silver Solder Paste for PCB SMT SMD BGA Reballing Video,Demo, How It Works & Features

Name: Sn62pb36AG2 MID Temperature Leaded Soldering Tin Lead Silver Solder Paste for PCB SMT SMD BGA Reballing
Uploaded: 2026-07-11T14:59:27+08:00
Description: Watch the Sn62pb36AG2 MID Temperature Leaded Soldering Tin Lead Silver Solder Paste for PCB SMT SMD BGA Reballing video demo to see how it works, key features, and real-use scenarios. A helpful video guide before you buy.

2026-07-16 2550

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Product Specifications

Model NO.:

Sn62pb36AG2 Solder Paste

state:

Liquid

pH:

Neutral

Type:

Organic

Melting Point:

<200℃

Chemical Composition:

Tin

Function:

Remove Oxides

Application:

SMT

Manufacturing Method:

Smelting

Alloy:

Lead Free

Powder Size:

Type 3: 25 to 45 Microns

Powder Size 2:

Type 4: 20 to 38 Microns

Flux:

No Clean Flux

Alloy 2:

Sac305 Sn96.5AG3.0cu0.5

Alloy 3:

Sac0307 Sn99AG0.3cu0.7

Alloy 4:

Sn42bi58 Low Temperature

Certificate:

RoHS

Packing:

Jar

Packing 2:

Syringe

Shipping:

Courier / Air Freight

Shelf Life:

6months

Storage:

0 to 10 Degree Celsius

Application 2:

for SMT SMD PCB Soldering

Application 3:

for Welding

Trademark:

XF Solder

Transport Package:

Foam Box

Specification:

100g to 1000g

Origin:

China

HS Code:

3810100000

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