Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D Video,Demo, How It Works & Features

Name: Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D
Uploaded: 2026-06-28T00:56:16+08:00
Description: Watch the Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D video demo to see how it works, key features, and real-use scenarios. A helpful video guide before you buy.

2026-07-13 5070

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Product Specifications

After-sales Service:

Engineer Online or at Site

Condition:

New

Certification:

ISO, CE

Warranty:

12 Months

Automatic Grade:

Semiautomatic

Installation:

Vertical

Name:

Vacuum Reflow Oven

Heating Plate:

Graphite

Soldering Area:

220mm*220mm

Chamber Height:

100mm

Atmosphere:

Nitrogen

Liquid:

Formic Acid

Vacuum:

10-1PA

Temperature:

450c (Higher Is Optional)

Uniformity:

+-2%C

Heating Rate:

120c/Minute

Cooling Way:

Nitrogen/ Water-Cooling (Shell, Heating Plate)

Cooling Rate:

120c/Minute

Voltage:

220V 63A

Trademark:

TORCH

Transport Package:

Wooden Case

Specification:

94*84*162cm

Origin:

Beijing, China

HS Code:

8514101000

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