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Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D

2025-04-09 4850

  • Solder Paste / Perform Vacuum Soldering Oven for Chip packaging in R&D

  • 485 views

Product Specifications

Engineer Online or at Site
New
ISO, CE
12 Months
Semiautomatic
Vertical
Vacuum Reflow Oven
Graphite
220mm*220mm
100mm
Nitrogen
Formic Acid
10-1PA
450c (Higher Is Optional)
+-2%C
120c/Minute
Nitrogen/ Water-Cooling (Shell, Heating Plate)
120c/Minute
220V 63A
TORCH
Wooden Case
94*84*162cm
Beijing, China
8514101000
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