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Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

Name: Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
Uploaded: 2025-04-07T22:46:48+08:00

2025-04-09 2630IP Unknown

China Fangda Manufacturing High Precision Single-Sided Surface Grinding Machine for All Kinds of Metal and Semiconductor Materials
322 views

Double-Sided Glass and Ceramic Surface Lapping and Polishing Machine
202 views

Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
263 views

High-Precision Hardware Accessories and Small Workpiece Surface Lapping Machine
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Pangda Ultra-Precision Polishing Double-Sided Grinding Machine
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Product Specifications

Model NO.:

FD-300QA

After-sales Service:

12months

Warranty:

12months

Type:

Surface Grinding Machine

Processing Object:

Flat Workpieces

Abrasives:

Grinding Wheel

Controlling Mode:

Pcl

Automatic Grade:

Semiautomatic

Cylindrical Grinder Type:

Surface Grinding Machine

Precision:

High Precision

Certification:

ISO 9001

Condition:

New

Power Source:

Electricity

Disc(Wheel) Type:

Grinding Disc

Variable Speed:

with Variable Speed

Application:

Semiconductor Material

Material:

Metal and Non-Metal

Working Style:

Reduction

Disc Diameter:

Φ300

Service:

Oversea Setup & After-Sale Avalaible

Class:

Single Plate

Process Station:

3

Pressure Source:

Pneumatic or Weight Block

Plate Material:

Metal & Non-Metal

Abrasive:

Slurry

Weight:

1000kg

Trademark:

PONDA

Transport Package:

Wood Crate

Origin:

China

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