T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58 Video,Demo, How It Works & Features

Name: T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58
Uploaded: 2026-07-18T22:42:06+08:00
Description: Watch the T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58 video demo to see how it works, key features, and real-use scenarios. A helpful video guide before you buy.

2026-07-16 3700

T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58

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Product Specifications

Model NO.:

Solder Paste

state:

Liquid

pH:

Neutral

Type:

Resin

Melting Point:

200℃-300℃

Chemical Composition:

Tin Lead Silver Copper

Function:

Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow

Application:

SMT Soldering

Manufacturing Method:

Smelting

Alloy:

Lead Free

Alloy 2:

Sac305 Sn96.5AG3.0cu0.5

Alloy 3:

Sac0307 Sn99AG0.3cu0.7

Alloy 4:

Sn42bi58 Low Temperature

Powder Size:

Type 3: 25 to 45 Microns

Powder Size 2:

Type 4: 20 to 38 Microns

Flux:

No Clean Flux

Certificate:

RoHS

Packing:

Jar

Packing 2:

Syringe

Shipping:

Courier / Air Freight

Shelf Life:

6months

Storage:

0 to 10 Degree Celsius

Application 1:

SMD Soldering

Application 2:

SMT Soldering

Trademark:

XF Solder

Transport Package:

Foam Box

Specification:

100g to 1000g

Origin:

China

HS Code:

3810100000

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