T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58 Video,Demo, How It Works & Features

2025-04-09 3650

Product Specifications

Solder Paste
Liquid
Neutral
Resin
200℃-300℃
Tin Lead Silver Copper
Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
SMT Soldering
Smelting
Lead Free
Sac305 Sn96.5AG3.0cu0.5
Sac0307 Sn99AG0.3cu0.7
Sn42bi58 Low Temperature
Type 3: 25 to 45 Microns
Type 4: 20 to 38 Microns
No Clean Flux
RoHS
Jar
Syringe
Courier / Air Freight
6months
0 to 10 Degree Celsius
SMD Soldering
SMT Soldering
XF Solder
Foam Box
100g to 1000g
China
3810100000
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