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T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58

Name: T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58
Uploaded: 2025-04-06T08:44:22+08:00

2025-04-09 3460IP Unknown

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Product Specifications

Model NO.:

Solder Paste

state:

Liquid

pH:

Neutral

Type:

Resin

Melting Point:

200℃-300℃

Chemical Composition:

Tin Lead Silver Copper

Function:

Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow

Application:

SMT Soldering

Manufacturing Method:

Smelting

Alloy:

Lead Free

Alloy 2:

Sac305 Sn96.5AG3.0cu0.5

Alloy 3:

Sac0307 Sn99AG0.3cu0.7

Alloy 4:

Sn42bi58 Low Temperature

Powder Size:

Type 3: 25 to 45 Microns

Powder Size 2:

Type 4: 20 to 38 Microns

Flux:

No Clean Flux

Certificate:

RoHS

Packing:

Jar

Packing 2:

Syringe

Shipping:

Courier / Air Freight

Shelf Life:

6months

Storage:

0 to 10 Degree Celsius

Application 1:

SMD Soldering

Application 2:

SMT Soldering

Trademark:

XF Solder

Transport Package:

Foam Box

Specification:

100g to 1000g

Origin:

China

HS Code:

3810100000

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