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T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58 Video,Demo, How It Works & Features

Name: T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58
Uploaded: 2025-11-16T03:31:38+08:00

2025-04-09 3590

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Product Specifications

Model NO.:

Solder Paste

state:

Liquid

pH:

Neutral

Type:

Resin

Melting Point:

200℃-300℃

Chemical Composition: