Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application

2025-04-09 2740IP Unknown

Product Specifications

5214BK
Structural Adhesive
Solvent
Automobile, Construction, Woodworking, Electronic Product
Acrylic
Thermosetting
Natural Polymer
Weatherability
Tackifier
Inorganic Material
Clear
Adhesive Glue
Acrylate Adhesive
Customization
Epoxy
80 Degrees 15min
3 Months < -28 Degrees
LCM Step Protection
Semiconductor Application
Strong
Acrylate
radhow
Carton
customization
China
3505200000
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