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Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

2025-04-09 4090IP Unknown

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Product Specifications

Model NO.:

MG-6410B-AU

Certification:

GS, RoHS, CE, ISO9001

Color:

Transparent

Heat Resistance:

Normal Temperature

Waterproof:

Waterproof

Application:

Wafer Dicing

Adhesive:

Acrylic

Base Material:

Po Film

Type:

Wafer UV Dicing Tape

Product Name:

UV Release Dicing Tape

Liner:

Pet Release Liner

Feature:

Easy Peeling No Residue

Adhesion Before UV:

280~380 G/in

Adhesion After UV Irradiation:

< 10 G/in

Customization:

Available

Trademark:

Migui

Transport Package:

Carton

Specification:

customizable

Origin:

Dongguan

You May Like: Wafer UV Dicing Tape, UV Release Dicing Tape, Single Sided, Acrylic Adhesive, Po Film, 140micron Matte Translucent, Easy Peeling, No Residue

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