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Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing Video,Demo, How It Works & Features

Name: Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Uploaded: 2026-03-03T17:59:07+08:00
Description: Watch the Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing video demo to see how it works, key features, and real-use scenarios. A helpful video guide before you buy.,Wafer UV Dicing Tape,UV Release Dicing Tape,Single Sided,Acrylic Adhesive,Po Film,140micron Matte Translucent,Easy Peeling,No Residue

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Product Specifications

Model NO.:

MG-6410B-AU

Certification:

GS, RoHS, CE, ISO9001

Color:

Transparent

Heat Resistance:

Normal Temperature

Waterproof:

Waterproof

Application:

Wafer Dicing

Adhesive:

Acrylic

Base Material:

Po Film

Type:

Wafer UV Dicing Tape

Product Name:

UV Release Dicing Tape

Liner:

Pet Release Liner

Feature:

Easy Peeling No Residue

Adhesion Before UV:

280~380 G/in

Adhesion After UV Irradiation:

< 10 G/in

Customization:

Available

Trademark:

Migui

Transport Package:

Carton

Specification:

customizable

Origin:

Dongguan

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