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18/00 1.0mm 41"X49" Fr4 Copper Clad Laminate Sheet Ccl for PCB
| Price | $35.00 |
|---|---|
| Min Order | 250 sheet |
| Availability | In Stock |
| Shipping From | Hainan, China |
| Popularity | 519 people viewed |
Model NO.:
FR4
Structure:
Single/Double-Sided Rigid PCB
Dielectric:
FR-4
Material:
Epoxy Fiber Galss Laminate
Application:
Consumer Electronics
Flame Retardant Properties:
V0, V1
Processing Technology:
Electrolytic Foil
Production Process:
Additive Process
Base Material:
Epoxy Fiber Galss
Insulation Materials:
Epoxy Resin
Brand:
Hjh
Sheet Thickness:
0.05-3.5mm
Copper Thickness:
18um, 35um, 105um, Others
Color:
Yellow
Market:
Euro, Asia, Central and South America
Trademark:
HJH
Transport Package:
Pallet
Specification:
41"x49", 43"x49", 1040x1245mm, 1090x1245mm, others
Origin:
China
HS Code:
7410211000
Product Description
FR4 Copper Clad Laminate Sheet
1.FEATURES
--Tg135±5ºC(DSC)
--Halogen-free, Br/Cl content below 900ppm
--UV Blocking/ AOI Compatible
--Antimony-free
--Conform to claim of RoHS
--IPC-4101B specification is applicable
2.APPLICATION
Computer,Mobile phone, Electronics Instrumentations Communication equipments etc.
3.TECHNICAL DATA SHEET
1.FEATURES
--Tg135±5ºC(DSC)
--Halogen-free, Br/Cl content below 900ppm
--UV Blocking/ AOI Compatible
--Antimony-free
--Conform to claim of RoHS
--IPC-4101B specification is applicable
2.APPLICATION
Computer,Mobile phone, Electronics Instrumentations Communication equipments etc.
3.TECHNICAL DATA SHEET
| Test Items | Unit | Test Condition | Test Method IPC-TM-650 | Specification | Typical Value | |
| Tg | ºC | DSC | 2.4.25 | ≥130 | 135 | |
| Peel strength 1oz | N/mm | 288ºC, 10s | 2.4.8 | ≥1.05 | 1.45 | |
| Flammability | Rating | C-48/23/50 | UL94 | V-0 | V-0 | |
| E-24/125 | ||||||
| Surface Resistivity | MΩ | C-96/35/90 | 2.5.17.1 | 104 | 2.0 X106 | |
| Volume Resistivity | MΩ-cm | C-96/35/90 | 2.5.17.1 | 106 | 5.0 X108 | |
| Arc Resistance | S | D-48/50+D-0.5/23 | 2.5.1 | 60 | 124 | |
| Dielectric Breakdown | KV | D-48/50+D-0.5/23 | 2.5.6 | 40 | 56 | |
| Dielectric Constant (1MHz) | _ | C-24/23/50 | 2.5.5.2 | <5.4 | 4.7 | |
| Dissipation Factor (1Mhz) | _ | C-24/23/50 | 2.5.5.9 | <0.035 | 0.016 | |
| Thermal Stress | Unetched | Sec | 288ºC, solder dip | 2.4.13.1 | ≥30 | Pass |
| Etched | ||||||
| Flexural Strength | LW | MPa | A | 2.4.4 | 415 | 565 |
| CW | 345 | 430 | ||||
| Water absorption | % | D-24/23 | 2.6.2.1 | 0.35 | 0.21 | |
| CTE Z-axis | Before Tg | μm/mºC | TMA | 2.4.24 | ≤60 | 50 |
| After Tg | μm/mºC | TMA | ≤300 | 280 | ||
| 50~260ºC | % | TMA | ≤3.0 | 2.9 | ||
| Td | ºC | 10ºC/min, N2,5% Wt Loss | 2.4.24.6 | ≥340 | 340 | |
| T260 | Min | TMA | 2.4.24.1 | - | 15 | |
| T288 | Min | TMA | 2.4.24.1 | - | 2 | |
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