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Laser Cutting Processing Ceramic Substrate PCB Aln Aluminium Nitride Substrate

Price $10.00
Min Order 10 Pieces
Availability In Stock
Shipping From Guangdong, China
Popularity 303 people viewed
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Model NO.:
JJBP-0141-0021
Application:
Electronic Devices, Lighting, Power Supply, Semiconductors
Application:
Blank Ceramic Circuit Board
Forming Method:
Tape Casting
Features:
High Thermal Conductivity, Cte Matching Si
Optional Color:
Gray, Ivory
Density:
Over 3.33G/Cm3
Standard Thickness:
0.1-3mm Available
Thickness Tolerance:
±0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance:
±2mm
Trademark:
JingHui
Transport Package:
Individual Package
Specification:
Max. up to 140mm× 190mm
Origin:
China
HS Code:
8547100000
Product Description
Laser Cutting Processing Ceramic Substrate PCB AlN Aluminium Nitride Substrate

Jinghui Ceramic has 15 years of R&D and production experience in the field of the aluminum nitride substrate. Our products have high cost performance and will definitely satisfy you.

Product Introduction
About Laser Cutting

Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.

Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.

With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.

As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Manufacturing Capacity

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

AlN Ceramic Substrate
Thickness (mm)Maximum Size (mm)ShapeMolding Technique
As-firedLappedPolishedRectangularSquareRound
0.1-0.2 50.850.8 √√Tape Casting
≥0.2 114.3114.3 √√Tape Casting
0.38140×190140×190120√√ Tape Casting
0.5140×190140×190120√√ Tape Casting
0.635140×190200200√√√Tape Casting
1140×190300200√√√Tape Casting
1.5 300200 √√Tape Casting
2 300200 √√Tape Casting
2.5 300  √√Tape Casting
3 300  √√Tape Casting
… 450  √√Isostatic Pressing
10 450  √√Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

Our Laser Processing Capability

(1) Hole Size
 
AlN Ceramic Substrate
Hole Diameter (mm)Standard Tolerance (mm)
φ≤0.50.08
φ>0.50.2

(2) Laser Scribing
 
AlN Ceramic Substrate
Substrate Thickness (mm)the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.340%±5%
0.5<T≤1.050%±3%
1.0<T≤1.255%±3%
1.2<T≤1.560%±3%
2.045% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

If you have specific requirements for laser cutting of the aluminum nitride substrate, please feel free to contact us.
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