Audited Supplier
What is Direct Bond Copper (DBC) technology?
Direct Bond Copper (DBC) technology is a metallization method of bonding copper foil on the ceramic surface (mainly Al2O3 and AlN). The basic principle is to introduce oxygen element between Cu and ceramic, then form Cu/O eutectic liquid phase at 1065-1083°C, and then react with ceramic substrate and copper foil to form CuAlO2 or Cu(AlO2)2, and realize the bonding between copper foil and substrate under the action of mesophase.
Because AlN belongs to non-oxide ceramics, the key to surface copper coating is to form an Al2O3 transition layer on its surface, and realize the effective bonding between the copper foil and the base ceramic under the action of the transition layer.
What are the Characteristics of DBC technology?
You will learn more about DBC through the following two tables.
The DBC method uses a high-temperature melting and diffusion process to bond the ceramic substrate and high-purity oxygen-free copper together.
The formed metal layer has good thermal conductivity, high adhesion strength, excellent mechanical properties, easy etching, high insulation and high thermal cycle capacity.
DBC ceramic substrates are widely used in the packaging and heat dissipation of Insulated Gate Bipolar Transistor (IGBT), Laser Diode (LD) and Concentrator Photovoltaics (CPV). Jinghui Ceramic strictly controls the eutectic temperature and oxygen content in the process of producing DBC ceramic substrates. The DBC technology has reached the industry-leading level and is worthy of your trust.
In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.
