Audited Supplier
JJBP-0141-0021
Electronic Devices, Lighting, Power Supply, Semiconductors
Blank Ceramic Circuit Board
Tape Casting
High Thermal Conductivity, Cte Matching Si
Gray, Ivory
Over 3.33G/Cm3
0.1-3mm Available
±0.03/0.05mm (Depending on Thickness)
±2mm
JingHui
Individual Package
Max. up to 140mm× 190mm
China
8547100000
Product Description
Laser Cutting Processing Ceramic Substrate PCB AlN Aluminium Nitride Substrate
Jinghui Ceramic has 15 years of R&D and production experience in the field of the aluminum nitride substrate. Our products have high cost performance and will definitely satisfy you.
Our Laser Processing Capability
(1) Hole Size
(2) Laser Scribing
Jinghui Ceramic has 15 years of R&D and production experience in the field of the aluminum nitride substrate. Our products have high cost performance and will definitely satisfy you.
About Laser Cutting
Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.
Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.
With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.
As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Ceramic substrate is the basic material of high-power electronic circuit structure technology and interconnection technology, and its structure is dense and brittle.
Conventional processing methods will generate stress during processing, and for thinner ceramic substrates, they are prone to fracture.
With the development trend of light weight and miniaturization, traditional cutting methods can no longer meet people's requirements for products.
As a non-contact processing tool, laser has greater advantages compared with traditional processing technology, and plays an important role in ceramic substrate processing.
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| AlN Ceramic Substrate | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As-fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| ≥0.2 | 114.3 | 114.3 | √ | √ | Tape Casting | ||
| 0.38 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.5 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.635 | 140×190 | 200 | 200 | √ | √ | √ | Tape Casting |
| 1 | 140×190 | 300 | 200 | √ | √ | √ | Tape Casting |
| 1.5 | 300 | 200 | √ | √ | Tape Casting | ||
| 2 | 300 | 200 | √ | √ | Tape Casting | ||
| 2.5 | 300 | √ | √ | Tape Casting | |||
| 3 | 300 | √ | √ | Tape Casting | |||
| … | 450 | √ | √ | Isostatic Pressing | |||
| 10 | 450 | √ | √ | Isostatic Pressing | |||
| Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. | |||||||
Our Laser Processing Capability
(1) Hole Size
| AlN Ceramic Substrate | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
(2) Laser Scribing
| AlN Ceramic Substrate | |
| Substrate Thickness (mm) | the Percentage of Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.5<T≤1.0 | 50%±3% |
| 1.0<T≤1.2 | 55%±3% |
| 1.2<T≤1.5 | 60%±3% |
| 2.0 | 45% (Extreme Depth) |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
If you have specific requirements for laser cutting of the aluminum nitride substrate, please feel free to contact us.
