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Manual Ultrasonic Thin Wire Wedge Bonding Machine
| Price | $8000.00 |
|---|---|
| Min Order | 1 Piece |
| Availability | In Stock |
| Shipping From | Guangdong, China |
| Popularity | 379 people viewed |
Model NO.:
mdb-2575
After-sales Service:
1 Year
Trademark:
minder-hightech
Transport Package:
Plywood Packing by Fast Express
Specification:
50kg
Origin:
Guangzhou
HS Code:
8515809090
Product Description
Application:
COB,IC,Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.
Specification:
1,electric requirement:220VAC±10%,50HZ,be sure connected to ground
2,wire diameter:25~75μm wedge bonding.
3,ultrasonic power:0-3W, two channel. can be set separately of the two point
4,bond time:5-200ms,two channel
5,bond force:10-60g,two channel
6, span between first bond to second bond by automatic mode:0-10mm(motorized)
7,bond radian: 0-6mm(motorized)
8, jig moving area: Φ16mm
9,mouse hand:20*20mm
10,digital camera: optional
11,dimension:600*560*390mm
12,weight:36kg
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guangzhou minder-hightech co.,ltd
contact:shunyu.hu
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