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Pdfn5*6 Sfs06r013ugf Vds-60V ID-520A RDS (ON) -1.6milliohm Qg-83.6nc Transistor Mode N-Channel Power Mosfet

Price $1.20
Min Order 5000 Pieces
Availability In Stock
Shipping From Shanghai, China
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Model NO.:
PDFN5*6 SFS06R013UGF
Certification:
RoHS, ISO
Shape:
Metal Porcelain Tube
Shielding Type:
Sharp Cutoff Shielding Tube
Cooling Method:
Air Cooled Tube
Function:
Switch Transistor
Working Frequency:
High Frequency
Structure:
Planar
Encapsulation Structure:
Chip Transistor
Power Level:
High Power
Trademark:
Orientalsemi
Transport Package:
Carton
Specification:
35x30x37cm
Origin:
China
HS Code:
8541290000
Product Description

General Description

FSMOS® MOSFET is based on Oriental Semiconductor's unique device design to achieve low RDS(ON), low gate charge, fast switching and excellent avalanche characteristics. The low Vth series is specially optimized for synchronous rectification systems with low driving voltage.

 

Features

  • Low RDS(ON) & FOM
  • Extremely low switching loss
  • Excellent reliability and uniformity
  • Fast switching and soft recovery
 

Applications

  • PD charger
  • Motor driver
  • Switching voltage regulator
  • DC-DC convertor
  • Switched mode power supply
 

Key Performance Parameters

ParameterValueUnit
VDS, min @ Tj(max)60V
ID, pulse520A
RDS(ON), max @ VGS=10V1.6
Qg83.6nC

Marking Information
 
Product NamePackageMarking
SFS06R013UGFPDFN5*6SFS06R013UG

 
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
ParameterSymbolValueUnit
Drain-source voltageVDS60V
Gate-source voltageVGS±20V
Continuous drain current1), TC=25 °CID130A
Pulsed drain current2), TC=25 °CID, pulse520A
Continuous diode forward current1), TC=25 °CIS130A
Diode pulsed current2), TC=25 °CIS, pulse520A
Power dissipation3), TC=25 °CPD140W
Single pulsed avalanche energy5)EAS155mJ
Operation and storage temperatureTstg, Tj-55 to 150°C
 

Thermal Characteristics

ParameterSymbolValueUnit
Thermal resistance, junction-caseRθJC0.89°C/W
Thermal resistance, junction-ambient4)RθJA62°C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
ParameterSymbolMin.Typ.Max.UnitTest condition
Drain-source breakdown voltageBVDSS60  VVGS=0 V, ID=250 μA
Gate threshold voltageVGS(th)1.5 2.5VVDS=VGS, ID=250 μA
Drain-source
on-state resistance
RDS(ON) 1.351.6VGS=10 V, ID=20 A
Drain-source
on-state resistance
RDS(ON) 2.13.0VGS=4.5 V, ID=20 A
Gate-source leakage current
IGSS
  100
nA
VGS=20 V
  -100VGS=-20 V
Drain-source leakage currentIDSS  1μAVDS=60 V, VGS=0 V
Gate resistanceRG 2.5 Ωƒ=1 MHz, Open drain
 

Dynamic Characteristics

ParameterSymbolMin.Typ.Max.UnitTest condition
Input capacitanceCiss 5162 pF
VGS=0 V, VDS=25 V,
ƒ=100 kHz
Output capacitanceCoss 2549 pF
Reverse transfer capacitanceCrss 105 pF
Turn-on delay timetd(on) 19.6 ns
VGS=10 V, VDS=30 V, RG=2 Ω, ID=30 A
Rise timetr 34.6 ns
Turn-off delay timetd(off) 68.3 ns
Fall timetf 24.4 ns

Gate Charge Characteristics
 
ParameterSymbolMin.Typ.Max.UnitTest condition
Total gate chargeQg 83.6 nC

VGS=10 V, VDS=30 V, ID=30 A
Gate-source chargeQgs 14.6 nC
Gate-drain chargeQgd 16.6 nC
Gate plateau voltageVplateau 3.2 V

Body Diode Characteristics
 
ParameterSymbolMin.Typ.Max.UnitTest condition
Diode forward voltageVSD  1.3VIS=20 A, VGS=0 V
Reverse recovery timetrr 58.1 ns
VR=30 V, IS=30 A,
di/dt=100 A/μs
Reverse recovery chargeQrr 55.1 nC
Peak reverse recovery currentIrrm 1.6 A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
  5. VDD=30 V,VGS=10 V, L=0.3 mH, starting Tj=25 °C.
 
 
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