0.635mm Solder PCB DCP Sheet Aln Aluminum Nitride Ceramic Substrate with Copper Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
BBXAN001
Application:
Electronics
Material:
Metalized Ceramic
Type:
Ceramic Plate
Process:
Direct Bonded Copper
Thickness:
0.38 mm
Application:
Structure Ceramic, Industrial Ceramic
Material:
Aluminum Nitride
Product Name:
Track Design Aln Aluminum Nitride Ceramic Substra
Feature:
Good Thermal Conductivity
Density(g/cm3):
3.3G/Cm3
Dielectric Strength:
≥15kv/mm
Surface Roughness:
0.3-0.5ra(μm)
Size:
Can Be Customised
Temperature:
High Temperature Resistant
Thermal Conductivity(20°c, W/M.K):
≥170
Corrosive Characteristics:
Corrosion Preventive
Flexural Strength (MPa):
≥330
Key Words 1:
Aln Aluminum Nitride Ceramic Substrate
Key Words 2:
Ain Ceramic Substrate with Copper
Type:
Ceramic Plates
Trademark:
BB
Transport Package:
Export Carton or Wood Boxes
Specification:
Be Customed
Origin:
China (Mainland)