Besi Datacon 8800 FC Quantum Advanced Die Bonding Machine Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
Datacon 8800 FC QUANTUM advanced
After-sales Service:
24 Hrs Online
Condition:
Used
Speed:
High Speed
Precision:
High Precision
Certification:
RoHS, ISO, CE
Warranty:
6 Months
Automatic Grade:
Automatic
Type:
Die Bonding Machine
Characteristics:
Used
Product Number:
Datacon 8800 FC Quantum Advanced
Quality:
Tested
Types:
Besi Die Bond Machine
Usage:
Die Bond Machine
Industry:
Chip Industry
Supply Ability:
2000 PCS
Price:
Good
Trademark:
BESI
Transport Package:
Carton Packing or Wooden Case
Specification:
One piece per package
Origin:
USA
HS Code:
8479909090