CZ Silicon Wafer Prime Quality Polished Semiconductor Silicon Oxide Wafer Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
6inch 300A
Application:
Semi Standard
Material:
Compound Semiconductor
Type:
P-Type Semiconductor
Growth Method:
CZ
Crystal Orientation:
100
Dopant:
Boron
Resistivity:
1-100Ω
Front Side:
Polished
Backside:
Etched
Diameter:
150±0.3mm
Thickness:
675±25mm
Oxide Thickness:
300A
Ttv:
≤10μm
Warp:
≤30μm
Bow:
≤30μm
Trademark:
FSM
Transport Package:
Semi Standard
Specification:
TBD
Origin:
China
HS Code:
3818001920