Electronic Direct Bond Copper Aln Plate Insulator Aluminum Nitride Ceramic Substrate Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
BBTAN001
Application:
Electronics
Type:
Ceramic Plate
Application:
Electronics, Refractory, Industrial Ceramic
Type:
Ceramic Plate
Function:
Wear Resistant
Process:
Porcelain Ceramic Plate
Material:
Aluminum Nitride
Color:
Ivory
Density:
3.3 g/cm3
Size:
Customized
Thermal Conductivity(30°c, W/M.K):
>170
Flexural Strength (MPa):
382.7
Keyword:
Copper Coated
Dielectric Strength (Kv/mm):
18.45
MOQ:
2 PCS
Keywords 1:
Aluminum Nitride Substrate
Keywords 2:
Copper Plating Substrate
Trademark:
BB
Transport Package:
Packaged by Polybay and Bubble Bag in The Stardard
Specification:
OEM
Origin:
China