Electronic Direct Bond Copper Amb Metallized Aln Plate Aluminum Nitride Ceramic Substrate Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
HBQ-E006
Application:
Electronics, Electronic Devices, Power Supply, Semiconductors
Type:
Ceramic Plate
Material:
Aln
Process:
Direct Bonded Copper
Material of Substrate:
Alumina/Aln
Conducting Layer:
0.5um-1mm
Technology:
Htcc/Dpc/Dbc
Film:
Single/Double
Surface:
Bare Cu/Ni-Plating/Au Plating
Feature:
Electrical Insulation/ High Thermal Conductivity
Usage:
Thick Film Circuit, Large-Scale Integrated Circuit
Keywords:
Customized Amb Metallized Aln Aluminum Nitride Cer
Trademark:
BAIBO
Transport Package:
Export Packing
Specification:
Customized
Origin:
China(Mainland); Jiangsu