High Temperature Solder Paste Sn5pb92.5AG2.5 Special for Semiconductor Packaging and Welding Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
SD-600
Component:
Sn5pb92.5AG2.5
Melting Point:
268-302ºC
Attribute:
RoHS Exempt
Tin Powder:
T3/T4
Application:
Semiconductor Welding
Trademark:
yoshida
Transport Package:
Carton Packaging
Specification:
500G
Origin:
China