Laser Cutting Processing Ceramic Substrate PCB Aln Aluminium Nitride Substrate Video, Demo, How It Works & Features
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Product Specifications
Model NO.:
JJBP-0141-0021
Application:
Electronic Devices, Lighting, Power Supply, Semiconductors
Application:
Blank Ceramic Circuit Board
Forming Method:
Tape Casting
Features:
High Thermal Conductivity, Cte Matching Si
Optional Color:
Gray, Ivory
Density:
Over 3.33G/Cm3
Standard Thickness:
0.1-3mm Available
Thickness Tolerance:
±0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance:
±2mm
Trademark:
JingHui
Transport Package:
Individual Package
Specification:
Max. up to 140mm× 190mm
Origin:
China
HS Code:
8547100000